As a Wafer Level Assembly and Die Preparation engineer joining our high-volume manufacturing (HVM) facility the successful candidate will be responsible for all aspects of their assigned module including safety, cost of operation, and labor productivity.
The scope of work and responsibilities of an Assembly or Die Prep engineer are very similar to those of a fab module engineer.
- Sustain the day-to-day operations of your area by responding to, containing, and dispositioning safety and quality concerns, addressing down tools, and implementing solutions to prevent repeat incidents.
- Continuously improve your area by proactively identifying and implementing safety and ergonomic improvements, excursion prevention measures, methods to increase tool utilization, and reduce cost.
The Ideal Candidate should exhibit the following behavioral traits:
- Written and verbal communication skills.
- Influence others and build consensus and trust within a team.
- Thrive in ambiguous environment and competing priorities.
- Creative thinker with the ability to resolve critical problems quickly and independently.
- Demonstrate ability of innovative thinking
- Demonstrate ability to develop solutions to problems by utilizing formal education, knowledge of manufacturing process, statistical knowledge, and problem-solving tools.
- Background and experience in wafer thinning, wafer bonding, chemical mechanical planarization/polishing (CMP).
This is an entry level and will be compensated accordingly.
- Candidate must possess a bachelor’s degree in Materials Science, Mechanical Engineering, Computer Science, Information Systems, Chemical Engineering, Electrical Engineering, Chemistry, Physics or any other related discipline.
- This position is not open for Intel immigration sponsorship
- 3+ Semiconductor or Wafer Assembly experience.
- 3+ years of experience with statistical process control techniques, problem solving methodology, data analysis, and/or change control systems.
Inside this Business Group
As the world’s largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art — from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.